The speed and production efficiency of the solder paste press are important indicators to evaluate its performance, and the following are detailed answers to these two aspects:

1. Printing speed

Printing speed refers to the speed at which the PCB (printed circuit board) moves during the printing process. The proper printing speed can ensure the uniform distribution of solder paste and good printing. The specific value of the printing speed is usually within a certain range, such as between 50mm/s and 200mm/s, but it may also change according to the different equipment. In practical applications, the printing speed needs to be adjusted according to factors such as the size of the PCB, the density of the components and the consistency of the solder paste. For example, when there are narrow-spaced, high-density graphics, the speed needs to be slowed down to ensure that the solder paste can penetrate into the opening and avoid printing defects such as incomplete solder paste formation or leakage.

Second, production efficiency

Production efficiency involves many aspects, including the printing cycle, the number of boards printed at a time, the stability and reliability of the equipment.

Printing cycle: The theoretical single-board printing cycle time of a fully automatic solder paste press is usually short, such as the 11-second standard (excluding the printing travel time). This means that under ideal circumstances, the device can complete the printing of a circuit board in a short time.

Number of boards printed at a time: This depends on the substrate processing capacity of the device and the size of the printed area. Some high-end devices support large-sized substrates, which can print multiple boards at once, thus improving production efficiency.

Stability and reliability of equipment: Stability and reliability of equipment are important for production efficiency. Stable equipment can reduce downtime and improve equipment utilization. The reliable equipment can ensure the consistency of printing quality and reduce the scrap rate.

In addition, the degree of automation of the equipment will also affect production efficiency. Fully automatic solder paste presses are usually equipped with advanced control systems and sensors, which can achieve accurate scraper control, steel mesh control and substrate positioning functions, thus greatly improving production efficiency.