Difficulties that may be encountered when solder paste printing machines include:

Solder paste plug holes and poor printing: Solder paste used for a long time leading to excessive viscosity, or stencil has a foreign body blocking the mesh, may lead to solder paste plug holes. In addition, excessive squeegee pressure, stencil wiping solvent sprayed too much, stencil hole wall is not smooth may also lead to poor printing

Machine failure: tin paste printing machine may encounter machine power supply abnormalities, power fuses burned, computer host power abnormalities or motherboard card abnormalities can not start and other issues, these will affect the normal operation of the machine

Automatic rubbing problems: If the rubbing paper sensor sensor is poor, rubbing paper is not installed, rubbing sensor sensor is poor, rubbing paper guide bar fixing screws loose or broken, rubbing paper roll shaft broken, rubbing paper drive chain abnormal or motor abnormal, may lead to not automatically rubbing the screen

Printing offset: Coordinate offset, poor Mark recognition, loose stencil fixing, unstable PCB stop, CAMERA touching PCB, Mark recognition snow, a loose AXIS or abnormal motor/motor drive card may lead to solder paste printing offset.

Tin paste even tin and pull the tip: tin paste is too thin, stencil and PCB have a gap, scraper scraping is not clean, stencil wipe is not clean, stencil opening problems may lead to tin paste even tin. And printing paste pull tip may be due to damage to the steel plate, printing area hot or paste sticky, squeegee blunt, squeegee pressure is too low, squeegee blade damage, poor substrate, printing gap and other issues caused by

Incomplete solder paste printing: steel paste plug holes, steel plate damage, the use of old or over a thousand of the paste, squeegee damage or blunt, squeegee pressure is too low or too high and the paste has a foreign body, the substrate is bad, the printing offset and other issues may lead to incomplete printing of the solder paste

Equipment parameter control: solder paste printing process requires accurate control of equipment parameters, such as squeegee pressure, stencil and PCB gap, paste viscosity, etc., improper settings of these parameters may lead to printing quality problems

Stencil problem: stencil opening accuracy, hole wall roughness, whether blocked, etc. will affect the printing quality of the paste, need to pay special attention to the maintenance and cleaning of the stencil

Paste quality problems: paste viscosity, metal content, fluidity and other characteristics will affect the printing, you need to choose the appropriate paste and properly stored

Need to be trained to understand the solder paste printing machine procedures to ensure that people and equipment