Solder paste and patch adhesive are thixotropic fluids with viscosity. When the scraper moves forward at a certain speed and angle, it will generate a constant pressure on the solder paste, push the solder paste to roll in front of the scraper, and generate the pressure required to inject the solder paste into the mesh or leakage hole. The viscous friction of solder paste makes the solder paste produce shear at the junction of scraper and screen plate, and the shear force reduces the viscosity of solder paste, which is conducive to the smooth injection of mesh or leakage of large-size solder paste printer. Scraper speed, scraper and net.

At present, the solder paste printing template mainly includes stainless steel template, and its production mainly includes three processes: chemical corrosion, laser cutting and electroforming.

Because the solder paste printed by the metal template and metal scraper is full, sometimes the printing with too thick thickness can be obtained, which can be corrected by reducing the thickness of the template.

Tin printing machine is a machine and equipment that uses mesh plate openings to leak electronic fibers (tin, patch amine, etc.) onto the circuit board in the SMT electronic assembly process. The purpose is to stick chip electronic components. Both solder and patch adhesive are variants with viscosity. When the scraper moves forward at a certain speed and angle, a certain pressure will be generated on the butt welding to push the welding to roll in front of the scraper and generate the pressure required to inject the welding incubation into the mesh or leakage hole of SMT steel mesh;