大尺寸锡膏印刷机

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How to adjust the printing offset of solder paste printing machine

2021-10-20 05:26:33
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The printing quality and service life of the printing press are not only related to the manufacturing accuracy of the machine, but also depend on the maintenance and lubrication during use to a great extent. In order to ensure the quality of printing products, improve the utilization rate of equipment, prolong its service life and prevent damage accidents, there are corresponding rules and regulations for the safe operation and maintenance of the machine, which are required to be strictly implemented.

Input amount of solder paste (rolling diameter): the rolling diameter of solder paste ∮ h ≈ 13 ~ 23mm is more appropriate. ∮ h is too small, which is easy to cause solder paste leakage and small amount of tin. ∮ h is too large. When the printing speed is constant, too much solder paste is easy to cause that the solder paste cannot form rolling movement, and the solder paste cannot be scraped clean, resulting in poor printing demoulding, thick solder paste after printing and other poor printing; And too much solder paste is exposed to the air for a long time, which is unfavorable to the quality of solder paste.

Solder Paste Printer

  At present, most of the positioning algorithms of patch automatic fading printer in the market are based on image gray level and realized through autocorrelation matching. For the copper plate with good surface uniformity, the gray algorithm can complete the automatic positioning function. K however, the emergence of more and more tinplate, gold-plated plate and flexible PCB has brought great challenges to gray-scale positioning.