The electronic equipment we use everyday is generally equipped with PCB substrate, which has many pads. In the SMT pad processing process, in order to paste the solder paste on a specific pad, it is necessary to make a steel plate corresponding to the position of the pad and install it on the solder paste printer to ensure the mesh and PCB of the steel plate.

The printing quality and service life of the solder paste printer largely depend on the manufacturing accuracy of the machine and the maintenance and lubrication of the solder paste printer. In order to ensure the quality of printed matter, improve the utilization rate of equipment, prolong its service life and prevent damage accidents, corresponding rules and regulations are stipulated for the safe operation and maintenance of the machine, which are required to be strictly implemented. For example, cleaning management system, refueling system within the time limit, safety operation procedures, regular inspection and maintenance system, PCBA manufacturing site management system, SMT patch processing operation specifications, etc.

1. Type of scraper: when the solder paste is printed by the solder paste printer, the appropriate scraper is selected according to the characteristics of the unused solder paste or red paste. At present, most of the mainstream scrapers are stainless steel.

2. Scraper angle: the angle at which the scraper scrapes the solder paste is usually between 45-60 degrees.

3. Scraper pressure: the pressure of the scraper of the solder paste printing machine affects the amount of solder paste. The greater the scraper pressure, the less the amount of solder paste. Due to the high pressure, the gap between the steel plate and the circuit board is compressed.

4. Scraper speed: the speed of scraper affects the shape and amount of solder paste printing, and also directly affects the quality of solder of solder paste printing machine. The general scraper speed is set between 20-80mm / s. In principle, the speed of the scraper must meet the viscosity of the solder paste. The faster the solder paste with better fluidity, the faster the scraper speed must be.

5. Whether to use vacuum base: the vacuum base of solder paste printing machine pastes the substrate in a fixed position smoothly, which helps to improve the tightness of steel plate and PCB substrate.

6. Whether the circuit board is deformed: the deformed circuit board will lead to uneven solder paste printing and short circuit of solder paste printer in most cases.

7. Steel plate cleaning: whether the steel plate is clean is related to the printing quality of the solder paste printer, especially the contact surface between the steel plate and the PCB substrate, so as to prevent the residual solder paste under the steel plate from appearing on the PCB where there should be no solder paste.