大尺寸锡膏印刷机

Information trendsNews

How to use solder paste printer

2021-06-08 02:15:35
second

      With the development of electronic industry and the popularization of automatic printing machines, the development time of solder paste printing machines in China is longer and longer. Domestic equipment developers have also established a technical team and service system for solder paste printing machines to engage in equipment development, process optimization and technical services. In other words, how to use the solder paste printing machine? Next, let Xiaobian introduce the process of using solder paste printer.

Solder Paste Printer

  

1、 Operation process:

1. Confirm before printing and check whether the required steel mesh, PCB, solder paste and other tooling are matched;

2. Check whether there are residual tin slag and other foreign matters in the steel mesh and whether the plate surface is cleaned;

3. Confirm whether the brand and model of solder paste used are correct. Here we take Deson brand as an example;

4. Confirm the temperature return and mixing time (4h for temperature return and 5 minutes for mixing);

5. The engineer can start the operation after placing the steel mesh and fixture on the printing machine and debugging all parameters. The program name is consistent with the actual required model. The scraper angle is 60-70 degrees, the printing speed is 40-80mm / s, and the scraper pressure is 3.0-5.0kgf/cm2 Demoulding speed: 0.3-2.0mm/sec. Automatic scrubbing frequency: 3-5pcs / time;

6. Before putting into operation, check the PCB for deformation, damage, foreign matter and oxidation, and wipe the surface with a dust-free cloth;

7. After the printing is completed, it needs to be checked with a magnifying glass;

(1) Less tin: whether the pad has exposed copper foil, and if the thickness of solder paste does not reach the thickness, it is less tin;

(2) Tin connection: solder paste is connected between pad and pad, which is tin connection, especially between row and insert, IC and pin, so it is mainly checked;

(3) More tin: the thickness of solder paste is more tin than that of steel plate;

(4) Collapse and sharpening: the distribution of solder paste pad is uneven;

8. For products with poor quality, first scrape off the solder paste on the board surface with a soft scraper, recycle the solder paste with an empty bottle with a red label, then clean the residual solder paste on the board surface and in the hole with a plate washing water brush, and then blow it clean with tools; (good products are cleaned with special tools)

9. The cleaned substrates shall be placed separately and marked with "△" with an oily pen on the edge of the plate. After being confirmed by IPQC, they shall be placed in the oven for baking;

10. When cleaning the steel mesh manually, the machine shall be in manual state, and wipe it from the bottom of the steel mesh with dust-free paper stained with a little cleaning liquid. Wipe it clean and then use tools to blow the residual solder paste in the hole from bottom to top. Depending on the quality condition, if it is bad for three consecutive times, immediately feed back to the project for adjustment, and then normal production can be carried out after it is OK;

11. When good products are placed in the grid, they shall be placed in the compartment. Complete the model and work order status in the process identification card;

12. PCB accumulation after printing shall not exceed 1 hour;

13. When adding solder paste, the rolling amount of the scraper shall prevail, and the solder paste missed on both sides of the scraper shall be received into the scraper in time;

14. Turn off the lights in time;

15. The project shall regularly check the wear condition of the blade once a week and replace it once a half year.