Aim at large LAN board and server board, HIT520HD, a 5G board screen printer and server board screen printer, adopts X-axis printing and X-axis cleaning that can automatically set up, which is more convenient and faster. In addition, the double-side board, having the maximum thickness of 25.4mm bottom plug-in, can be produced, to prevent the damage caused by manual operation error; Other exceptional requirements can be allow to being customized on the basis of standard HIT520HD. |
main parameter | |||
type | HIT520HD | remarks | |
Steel mesh | Minimum size of steel mesh(mm) | 736*550 | |
Maximum size of steel mesh(mm) | 1500*736 | ||
PCB | Minimum size(L*W mm) | 80*80 | |
Maximum size(L*W mm) | 1200*500 | ||
thickness(mm) | 0.4-8 | ||
Maximum weight(Kg) | 1OKg | ||
Height of bottom element(mm) | 25.4mm | ||
Printing time | speed(mm/Sec) | 1-300mm/Sec | Editable |
Automatic pressure control(Kg) | 4-20Kg | Scraper pressure is adjustable and programmed | |
Cycle time(Sec) | 14Sec | Standard PCB 200 * 200 (excluding printing time) | |
accuracy | Repetition accuracy | ±12.5㎛ @ 6σ | |
Printing accuracy | ±25㎛@ 6 Sigma, Cpk≥ 2 | ||
other | supply gas | 4 ~ 6 Kg/㎠ | |
power supply | 220V ±10% Single Phase, MAX 1Kw 50/60 Hz | ||
weight | 1200 Kg | ||
Equipment size | 2,250 *1,423* 1,430 mm |
General parameters | |||
type | HIT520series | remarks | |
Steel mesh | Steel mesh fixing | Cylinder | |
Steel mesh positioning | automatic | ||
PCB | PCB fixing mode | Top clamp, side clamp, vacuum | Smart device Steel mesh vacuum, flippe |
PCB support | Magnetic thimble (3mm, 16mm) Support block, vacuum top block, vacuum box | ||
Three section conveying guide rail | Transmission direction | Left → left, right → right, left → right, right → left | Right → left: Options |
Guide rail width adjustment | Platform: automatic In / out: automatic | In / out: Manual (Minus Option) | |
scraper | Squeegee Type | DLC diamond-like carbon scraper | |
length | L=280 mm(50-240 mm) L=320 mm(50-280 mm) L=400 mm(50-360 mm) L=460 mm(50-420 mm) L=560 mm(50-520 mm | Adjustable type (standard) User defined length 600 mm770 mm (fixed) (option) | |
Mark datum | type | User defined image | |
size | 0.5-3mm | ||
Number of datum points | 2, 3 or 4 mark reference point positioning | ||
Benchmark search | automatic | ||
Film removal | Film removal | Normal / vacuum | Smart decompression |
speed | 0.5-30mm/Sec | Programmable | |
distance | 0-5mm | Programmable | |
Place thimble | Automatic gripper placement thimble | 3mm, 16mm automatic identification And automatically check the thimble position | Optional |
Placing thimble with laser indication | 3mm, 16mm manual setting And automatically check the thimble position | Standard configuration | |
Cleaning system | Cleaning type | Dry, wet, vacuum, blowing | Length of cleaning head 350mm (standard), 460mm,520mm,600mm |
Shampoo | Silicone pad | ||
Moving direction | Standard (Y-axis movement), LED & long board and large board (moving in x-axis direction) | ||
SPI docking communication | SPI feedback automatic correction function | Less tin, missing printing, solder paste connection Over 0.2 mm | |
2DI detection | Camera FOV | 8.5mm*8mm,CIS640*480 Japan | |
testing Test size | Less tin, missing printing, solder paste connection Over 0.2 mm | ||
Number of detection pictures | Up to 500 screens can be displayed | ||
Fan | Film removal and PCB fixing | Vacuum separation (standard) | |
air conditioning system | Automatic temperature and humidity control | Temperature: 20 ℃ ~ 30 ℃ Single phase AC220V | |
Line change time | Old program | 2 Min. | |
New product setup time | 5 Min. |
main parameter | |||
type | HIT520HD | remarks | |
Steel mesh | Minimum size of steel mesh(mm) | 736*550 | |
Maximum size of steel mesh(mm) | 1500*736 | ||
PCB | Minimum size(L*W mm) | 80*80 | |
Maximum size(L*W mm) | 1200*500 | ||
thickness(mm) | 0.4-8 | ||
Maximum weight(Kg) | 1OKg | ||
Height of bottom element(mm) | 25.4mm | ||
Printing time | speed(mm/Sec) | 1-300mm/Sec | Editable |
Automatic pressure control(Kg) | 4-20Kg | Scraper pressure is adjustable and programmed | |
Cycle time(Sec) | 14Sec | Standard PCB 200 * 200 (excluding printing time) | |
accuracy | Repetition accuracy | ±12.5㎛ @ 6σ | |
Printing accuracy | ±25㎛@ 6 Sigma, Cpk≥ 2 | ||
other | supply gas | 4 ~ 6 Kg/㎠ | |
power supply | 220V ±10% Single Phase, MAX 1Kw 50/60 Hz | ||
weight | 1200 Kg | ||
Equipment size | 2,250 *1,423* 1,430 mm |
General parameters | |||
type | HIT520series | remarks | |
Steel mesh | Steel mesh fixing | Cylinder | |
Steel mesh positioning | automatic | ||
PCB | PCB fixing mode | Top clamp, side clamp, vacuum | Smart device Steel mesh vacuum, flippe |
PCB support | Magnetic thimble (3mm, 16mm) Support block, vacuum top block, vacuum box | ||
Three section conveying guide rail | Transmission direction | Left → left, right → right, left → right, right → left | Right → left: Options |
Guide rail width adjustment | Platform: automatic In / out: automatic | In / out: Manual (Minus Option) | |
scraper | Squeegee Type | DLC diamond-like carbon scraper | |
length | L=280 mm(50-240 mm) L=320 mm(50-280 mm) L=400 mm(50-360 mm) L=460 mm(50-420 mm) L=560 mm(50-520 mm | Adjustable type (standard) User defined length 600 mm770 mm (fixed) (option) | |
Mark datum | type | User defined image | |
size | 0.5-3mm | ||
Number of datum points | 2, 3 or 4 mark reference point positioning | ||
Benchmark search | automatic | ||
Film removal | Film removal | Normal / vacuum | Smart decompression |
speed | 0.5-30mm/Sec | Programmable | |
distance | 0-5mm | Programmable | |
Place thimble | Automatic gripper placement thimble | 3mm, 16mm automatic identification And automatically check the thimble position | Optional |
Placing thimble with laser indication | 3mm, 16mm manual setting And automatically check the thimble position | Standard configuration | |
Cleaning system | Cleaning type | Dry, wet, vacuum, blowing | Length of cleaning head 350mm (standard), 460mm,520mm,600mm |
Shampoo | Silicone pad | ||
Moving direction | Standard (Y-axis movement), LED & long board and large board (moving in x-axis direction) | ||
SPI docking communication | SPI feedback automatic correction function | Less tin, missing printing, solder paste connection Over 0.2 mm | |
2DI detection | Camera FOV | 8.5mm*8mm,CIS640*480 Japan | |
testing Test size | Less tin, missing printing, solder paste connection Over 0.2 mm | ||
Number of detection pictures | Up to 500 screens can be displayed | ||
Fan | Film removal and PCB fixing | Vacuum separation (standard) | |
air conditioning system | Automatic temperature and humidity control | Temperature: 20 ℃ ~ 30 ℃ Single phase AC220V | |
Line change time | Old program | 2 Min. | |
New product setup time | 5 Min. |