Aim at 1.5m&1.8m super large PCB board, for example, LED light bar and LED panel, HIT520HL(II) printer adopts X-Axis printing and cleaning system which make squeegee pressure well-distributed and can save solder paste and cleaning paper. As well as utilizing a vacuum pump with large suction so that thoroughly clean the mask. The mode of Fixing PCB adopts side clamp, top clamp and vacuum suck. Moreover, a large capacity of 500CC needle-cylinder type automatic solder paste supply for customers to select. |
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main parameter | |||
Type | HIT520HL | Remarks | |
Steel mesh | Minimum size of steel mesh（mm） | 736*736 | |
Maximum size of steel mesh（mm） | 1850*736 | ||
PCB | Minimum size（L*W mm） | 80*80 | |
Maximum size（L*W mm） | 1550*560 | ||
Maximum weight（mm) | 0.4-6 | ||
Maximum weight(Kg) | 1OKg | ||
Height of bottom element（mm） | 14mm | ||
Printing time | speed（mm/Sec) | 1-300mm/Sec | Editable |
Automatic pressure control(Kg) | 4-20Kg | Scraper pressure is adjustable and programmed | |
Cycle time(Sec） | 16Sec | Standard PCB 200 * 200 (excluding printing time) | |
accuracy | Repetition accuracy | ±12.5㎛ @ 6σ | |
Printing accuracy | ±25㎛@ 6 Sigma, Cpk≥ 2 | ||
other | supply gas | 4 ~ 6 Kg/㎠ | |
power supply | 220V ±10% Single Phase, MAX 1Kw 50/60 Hz | ||
weight | 1500 Kg | ||
Equipment size | 2,600 *1,465* 1,430 mm | ||
General parameters | |||
type | HIT520series | remarks | |
Steel mesh | Steel mesh fixing | Cylinder | |
Steel mesh positioning | automatic | ||
PCB | PCBFixed mode | Top clamp, side clamp, vacuum | Smart device Steel mesh vacuum, flippe |
PCB brace |
Magnetic thimble (3mm, 16mm) Support block, vacuum top block, vacuum box | ||
Three section conveying guide rail | Transmission direction | Left → left, right → right, left → right, right → left | Right → left: Options |
Guide rail width adjustment | Platform: automatic In / out: automatic | In / out: Manual （Minus Option） | |
scraper | Squeegee Type | DLC diamond-like carbon scraper | |
length | L＝280 mm（50-240 mm） L＝320 mm（50-280 mm） L＝400 mm（50-360 mm） L＝460 mm（50-420 mm） L＝560 mm（50-520 mm | Adjustable type (standard) User defined length 600 mm770 mm (fixed) (option) | |
MarkDatum point | type | User defined image | |
size | 0.5-3mm | ||
Number of datum points | 2, 3 or 4 mark reference point positioning | ||
Benchmark search | automatic | ||
Film removal | Film removal | Normal / vacuum | Smart decompression |
speed | 0.5-30mm/Sec | Programmable | |
distance | 0-5mm | Programmable | |
Place thimble | Automatic gripper placement thimble | 3mm，16mm automatic recognition And automatically check the thimble position | Optional |
Placing thimble with laser indication | 3mm, 16mm manual setting And automatically check the thimble position | Standard configuration | |
Cleaning system | Cleaning type | Dry, wet, vacuum, blowing | Length of cleaning head 350mm (standard), 460mm，520mm，600mm |
Shampoo | Silicone pad | ||
Moving direction | Standard (Y-axis movement), LED & long board and large board (moving in x-axis direction) | ||
SPI docking communication | SPI feedback automatic correction function | Correction printing function, Automatic cleaning function | |
2DI detection | Camera FOV | 8.5mm*8mm，CIS640*480 Japan | |
testing Test size | Less tin, missing printing, solder paste connection Over 0.2 mm | ||
Number of detection pictures | Up to 500 screens can be displayed | ||
Fan | Film removal and PCB fixing | Vacuum separation (standard) | |
air conditioning system | Automatic temperature and humidity control | Temperature: 20 ℃ ~ 30 ℃ Single phase AC220V | |
Line change time | Old program | 2 Min. | |
New product setup time | 5 Min. | ||
main parameter | |||
Type | HIT520HL | Remarks | |
Steel mesh | Minimum size of steel mesh（mm） | 736*736 | |
Maximum size of steel mesh（mm） | 1850*736 | ||
PCB | Minimum size（L*W mm） | 80*80 | |
Maximum size（L*W mm） | 1550*560 | ||
Maximum weight（mm) | 0.4-6 | ||
Maximum weight(Kg) | 1OKg | ||
Height of bottom element（mm） | 14mm | ||
Printing time | speed（mm/Sec) | 1-300mm/Sec | Editable |
Automatic pressure control(Kg) | 4-20Kg | Scraper pressure is adjustable and programmed | |
Cycle time(Sec） | 16Sec | Standard PCB 200 * 200 (excluding printing time) | |
accuracy | Repetition accuracy | ±12.5㎛ @ 6σ | |
Printing accuracy | ±25㎛@ 6 Sigma, Cpk≥ 2 | ||
other | supply gas | 4 ~ 6 Kg/㎠ | |
power supply | 220V ±10% Single Phase, MAX 1Kw 50/60 Hz | ||
weight | 1500 Kg | ||
Equipment size | 2,600 *1,465* 1,430 mm | ||
General parameters | |||
type | HIT520series | remarks | |
Steel mesh | Steel mesh fixing | Cylinder | |
Steel mesh positioning | automatic | ||
PCB | PCBFixed mode | Top clamp, side clamp, vacuum | Smart device Steel mesh vacuum, flippe |
PCB brace |
Magnetic thimble (3mm, 16mm) Support block, vacuum top block, vacuum box | ||
Three section conveying guide rail | Transmission direction | Left → left, right → right, left → right, right → left | Right → left: Options |
Guide rail width adjustment | Platform: automatic In / out: automatic | In / out: Manual （Minus Option） | |
scraper | Squeegee Type | DLC diamond-like carbon scraper | |
length | L＝280 mm（50-240 mm） L＝320 mm（50-280 mm） L＝400 mm（50-360 mm） L＝460 mm（50-420 mm） L＝560 mm（50-520 mm | Adjustable type (standard) User defined length 600 mm770 mm (fixed) (option) | |
MarkDatum point | type | User defined image | |
size | 0.5-3mm | ||
Number of datum points | 2, 3 or 4 mark reference point positioning | ||
Benchmark search | automatic | ||
Film removal | Film removal | Normal / vacuum | Smart decompression |
speed | 0.5-30mm/Sec | Programmable | |
distance | 0-5mm | Programmable | |
Place thimble | Automatic gripper placement thimble | 3mm，16mm automatic recognition And automatically check the thimble position | Optional |
Placing thimble with laser indication | 3mm, 16mm manual setting And automatically check the thimble position | Standard configuration | |
Cleaning system | Cleaning type | Dry, wet, vacuum, blowing | Length of cleaning head 350mm (standard), 460mm，520mm，600mm |
Shampoo | Silicone pad | ||
Moving direction | Standard (Y-axis movement), LED & long board and large board (moving in x-axis direction) | ||
SPI docking communication | SPI feedback automatic correction function | Correction printing function, Automatic cleaning function | |
2DI detection | Camera FOV | 8.5mm*8mm，CIS640*480 Japan | |
testing Test size | Less tin, missing printing, solder paste connection Over 0.2 mm | ||
Number of detection pictures | Up to 500 screens can be displayed | ||
Fan | Film removal and PCB fixing | Vacuum separation (standard) | |
air conditioning system | Automatic temperature and humidity control | Temperature: 20 ℃ ~ 30 ℃ Single phase AC220V | |
Line change time | Old program | 2 Min. | |
New product setup time | 5 Min. | ||
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