Thickness settings for solder paste printers usually depend on the printing requirements and equipment specifications. Thickness setting involves the following factors:
Gap Setting: The gap between the printing plate and squeegee directly affects the thickness of the solder paste. This gap is usually set by adjusting the parameters of the printing machine.
Squeegee Pressure: The pressure exerted by the squeegee on the printing plate also affects the thickness of the paste, which usually needs to be adjusted according to the viscosity of the paste and the surface characteristics of the printing plate.
Viscosity: The higher the viscosity of the paste, the greater the thickness of the printed film, so it needs to be adjusted according to the specific viscosity of the paste.
Printing speed (Printing Speed): the speed of printing will also affect the thickness of the paste, usually faster printing speed will lead to a thinner layer of paste.
Surface Treatment: The surface treatment of the printed board (such as tin spraying, gold plating, etc.) will also affect the adhesion and thickness of the solder paste.
Setting the right paste thickness usually requires experimenting and adjusting these parameters to achieve the desired print and quality. Settings depend on specific printing requirements and equipment characteristics.