Solder paste printing machine is the equipment deployment for printing solder paste on PCB board, which has a great impact on SMT process and quality. Now, solder paste printing machine is mainly divided into semi-active printing machine and fully active printing machine. At present, the common printing methods are divided into touch printing and 'non touch printing'. The printing method with gap between steel mesh and PCB is "non touch printing". Generally, the void division value is 0.5 ~ 1.0mm.

　　Suitable for solder paste with different viscosity. The solder paste is pushed into the steel mesh opening by the scraper and touched with the PCB pad. After the scraper is removed gradually, the steel mesh will be separated from the PCB actively, which can reduce the risk of steel mesh pollution caused by vacuum leakage. The instantaneous speed of the steel mesh leaving the PCB is the separation speed, which is a parameter related to the printing quality. It is important in dense spacing and high-density printing. After printing the solder paste, the instantaneous speed of the template leaving the printed circuit board is the separation speed, which is related to the parameters of printing quality. This is important in narrow spacing, high-density printing. Advanced printing equipment has one or more small stay processes when the template leaves the solder paste pattern, that is, multi-stage demoulding, so as to ensure the forming of printing.