The matching accuracy of each working position of the solder paste printing machine is usually expressed as the average value of the position deviation of 100 consecutive reciprocating movements of each moving shaft. It is a key index to comprehensively reflect the reproducibility of each combined shaft of the printing machine and measure the advantages and disadvantages of the design of the printing machine.

The solder paste printer adopts three methods: dry cleaning, wet cleaning and vacuum cleaning. The full-automatic solder paste printer should automatically clean the steel mesh and ensure the printing quality. With the development of SMT, the gap is small and the speed is fast. Many pull points and even tin on PCB are closely related to cleaning. The quality of automatic cleaning is directly related to the quality of products. The speed, that is, the efficiency of production, can be realized only with the improvement of cleaning function.

　　The positioning and fixing methods include reference hole positioning, reference edge positioning, simultaneous positioning of reference edge of reference hole, template positioning and other different accurate positioning forms. The vacuum suction cup system (optional) laser point-to-point system for BGA ball planting and device tin printing can improve the artificial point-to-point speed and effectively improve the calibration accuracy for high-precision printing (optional);