大尺寸锡膏印刷机

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What are the product features of automatic solder paste printing machine?

2021-06-01 02:02:56
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Product features:

▲ the whole machine is controlled by full servo system;

▲ configure automatic pressure feedback system;

▲ multifunctional image processing system;

▲ accurate PCB transportation system;

▲ PCB intelligent clamping device;

▲ automatic positioning module of steel mesh;

▲ automatic and effective steel mesh cleaning system;

▲ humanized operation interface;



Automatic solder paste printing machine

  

Automatic solder paste printing machine

1. Flexible clamping and positioning device for PCB board of full-automatic solder paste printing machine

Composition: vacuum box assembly, vacuum platform, magnetic thimble, flexible splint device, etc.

Function: the flexible board processing device can locate and clamp PCB substrates of various sizes and thicknesses. It is equipped with movable magnetic thimble and vacuum adsorption device to effectively control the deflection of PCB substrates and prevent board deformation.

2. Screen clamping device structure of full-automatic solder paste printing machine

Composition: including screen moving device and screen fixing device, etc.

Function: the width of the clamping net plate is adjustable, and the position of the steel net can be fixed and clamped.

3. The automatic solder paste printer adopts advanced image visual recognition system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB and template, and ensure the printing accuracy of ± 0.025mm. High precision servo motor drive and PC control ensure printing accuracy and stability. Accurate image recognition technology has ± 0.01mm repeated positioning accuracy.

4. The full-automatic solder paste printing machine adopts an independent suspended printing head and a programmable automatic cylinder pressure adjustment system, which can timely feed back the pressure and automatically balance the scraper pressure online. The pressure control is accurate, which can achieve better solder paste forming effect. The manual / automatic screen bottom cleaning function can be selected. Automatic, non auxiliary screen bottom cleaning function, programmable control of dry, wet or, cleaning interval can be freely selected, which can completely remove the residual solder paste in the mesh and ensure the printing quality.

5. The full-automatic solder paste printing machine is a combined workbench, which can set and place the thimble and vacuum suction cylinder according to the size of PCB substrate, making the clamping faster and easier. The multifunctional board processing device can automatically locate and clamp PCB boards of various sizes and thicknesses, with movable magnetic thimble, vacuum platform and vacuum box, which can effectively overcome the deformation of the board and ensure the uniformity of tin under printing.

6. Automatic screen cleaning device for full-automatic solder paste printing machine

Composition: including vacuum tube, vacuum generator, cleaning fluid storage and spraying device, paper winding device, lifting cylinder, etc. The screen cleaning device is installed behind the vision system, which determines the cleaning stroke and automatically cleans the bottom of the screen.

Function: when cleaning, the cleaning roll paper rises and moves close to the bottom of the template, and the used cleaning paper is continuously wound onto another drum. The cleaning interval can be freely selected, and the cleaning stroke can be set according to the printing stroke. During wet washing, when the cleaning liquid in the storage tank is insufficient, the system will give an alarm display, and it should be filled with cleaning liquid at this time. Dry, wet and vacuum washing cycles can be adjusted freely.

Function: the fully automatic screen cleaning device with programmable control has a combination of dry, wet and vacuum cleaning methods to completely remove the residual solder paste in the screen holes and ensure the printing quality.